SN-VR-PO3 – Thermography Inspection Machine

About SN-VR-PO3 – Thermography Inspection Machine

The SN-VR-PO3 is a high-performance thermal inspection system designed to detect voids beneath the DIE in LED and semiconductor components — all without using X-ray. With its thermal imaging technology, this machine evaluates heat distribution and performance with precision and reliability.

Built for demanding production environments, it features a high-resolution thermography camera, accurate temperature detection, and smart defect marking. With a compact footprint and MES/SECSGEM compatibility, the SN-VR-PO3 is the smart choice for heat-sensitive inspection needs.

Item Details
Input Power AC100–240V ±15%, 50Hz–60Hz, 20Amp
CDA 0.4–0.7 Mpa
Size (L×W×H) 1500mm × 900mm × 1650mm
Weight About 500 kg; supports MES, SECS/GEM, Mapping
Computer High-performance industrial PC, ≥8GB memory
Thermography Camera Resolution: 384×288; Temp range: 20°–150°C; Accuracy: ±2°; Imaging: 10×7mm
Lighting Rate ≥99%
MTBA ≤1 time/hour
Marking Marker pen or laser marking for defective products
Machine Speed ≥3.6K/hour (single channel)
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