The SN-VR-P05 is engineered for high-precision inspection of IC wire pads, wafers, and related semiconductor components. Integrated with a 3D laser detection system, it ensures accurate analysis of tiny defects such as cracks, scratches, and poor ball implantation — reducing human error while improving speed and consistency.
With advanced AI-powered optical tools and deep learning capabilities, the machine adapts to complex testing needs and various product types. It also supports full system integration, including MAP, MES, and SECS/GEM, making it a smart and scalable solution for modern wafer inspection lines.
Item | Details |
---|---|
Input Power | AC100–240V ±15%, 50Hz–60Hz, 20Amp |
CDA | 0.4–0.6 Mpa, 100 L/min |
Size (L×W×H) | 1500mm × 1100mm × 2000mm |
Weight | About 500 kg |
Inspection Criteria | Cracks, scratches, chip defects, foreign objects, poor ball implantation, etc. |
Compatibility | AI-powered optical inspection with deep learning. Customizable by evaluation. |
Function | Supports MAP, MES, SECS/GEM integration |
Accuracy | Up to micrometer-level precision, based on detection requirements |
Speed | 65,000 pieces per 4 hours (based on 8-inch wafer products) |
Got a question or need more info? We’re just an email away — feel free to reach out anytime
yikchean.png@provisiontech.com.my
Want to improve your production with smart inspection solutions? Let’s talk. Our team is ready to understand your needs and offer the right solution — no pressure, just a helpful chat.
yikchean.png@provisiontech.com.my
5, Lorong Nagasari 2, Taman Nagasari, 13600 Prai, Penang,Malaysia.