This semi-automatic inspection system is ideal for die bonding, wire bonding, or whole board inspection processes. Built with high-performance PC configuration and equipped with a set of 5D cameras, it delivers clear, accurate visual detection for bonding and wiring defects.
It detects issues such as double bonding, die offset, broken wires, scratches, sagging, and more — improving product quality and minimizing manual inspection errors. Suitable for electronics and semiconductor production lines that need a reliable, semi-automated quality control solution.
| Item | Details |
|---|---|
| Input Power | AC240V ±15%, 50Hz–60Hz |
| Compress Dry Air | 0.4–0.7 Mpa, 100 L/min |
| Size (L×W×H) | 1200mm × 900mm × 2000mm |
| Weight | About 550 kg |
| PC Configuration | FWS-610A / i9-9900K / 16G RAM / 256G SSD |
| Camera Information | 1 Set of 5D Cameras |
| Test Items | Double bonding, die offset, wire broken, scratches, wire sagging, crossing or missing wire |
Got a question or need more info? We’re just an email away — feel free to reach out anytime
Want to improve your production with smart inspection solutions? Let’s talk. Our team is ready to understand your needs and offer the right solution — no pressure, just a helpful chat.
At Provision Tech, we specialize in importing high-quality products from Seeney, ensuring the best value for our customers. Our mission is to provide reliable, innovative solutions that help businesses succeed.
yikchean.png@provisiontech.com.my
5, Lorong Nagasari 2, Taman Nagasari, 13600 Prai, Penang,Malaysia.
