The SN-VR-PO3 is a high-performance thermal inspection system designed to detect voids beneath the DIE in LED and semiconductor components — all without using X-ray. With its thermal imaging technology, this machine evaluates heat distribution and performance with precision and reliability.
Built for demanding production environments, it features a high-resolution thermography camera, accurate temperature detection, and smart defect marking. With a compact footprint and MES/SECSGEM compatibility, the SN-VR-PO3 is the smart choice for heat-sensitive inspection needs.
Item | Details |
---|---|
Input Power | AC100–240V ±15%, 50Hz–60Hz, 20Amp |
CDA | 0.4–0.7 Mpa |
Size (L×W×H) | 1500mm × 900mm × 1650mm |
Weight | About 500 kg; supports MES, SECS/GEM, Mapping |
Computer | High-performance industrial PC, ≥8GB memory |
Thermography Camera | Resolution: 384×288; Temp range: 20°–150°C; Accuracy: ±2°; Imaging: 10×7mm |
Lighting Rate | ≥99% |
MTBA | ≤1 time/hour |
Marking | Marker pen or laser marking for defective products |
Machine Speed | ≥3.6K/hour (single channel) |
Got a question or need more info? We’re just an email away — feel free to reach out anytime
yikchean.png@provisiontech.com.my
Want to improve your production with smart inspection solutions? Let’s talk. Our team is ready to understand your needs and offer the right solution — no pressure, just a helpful chat.
yikchean.png@provisiontech.com.my
5, Lorong Nagasari 2, Taman Nagasari, 13600 Prai, Penang,Malaysia.